• Pad-Per-Hole pattern on component side.
• Overall Ground Plane pattern on wiring side.
• 0.080” diameter isolated solder pad around holes on
component side.
• Plane surfaces solder coated for user convenience.
Downloads
Dimensions (H x W x Thick) | 4.50" x 6.50" x 0.062" (114.3mm x 165.1mm x 1.57mm) |
| Hole Diameter | 0.042" (1.067mm) Not Plated Thru |
| Grid | 0.100" x 0.100" (2.54mm x 2.54mm) |
| Circuit Pattern | Pad per hole - component side Overall ground plane - wiring side |
| Material | CEM-1 |
| UL Flammability Class | 94V-0 |
| 16 Pin DIP Capacity | 60 |
| Wire-Wrap Terminals | T44, T46, T49, T68 |
| Solder Terminals | T42-1, K24C, K31C |
| Wire-Wrap Socket Pins | R32 |
Specifications
Description
Ordering Info
Part Number : 8007